Integrated circuit package having die with staggered bond pads and die pad assignment methodology for assembly of staggered die in single-tier ebga packages
AssigneeNational Semiconductor Corporation
InventorAnindya Poddar
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Abstract
A single tier cavity down integrated circuit package having a die with outer bond pads and staggered inner bond pads is described. The bond pads of the die are assigned to associated supply rings and bond fingers of the package according to a design methodology where in one embodiment at least all bond pads connected to the supply rings are outer bond pads, and staggered inner bond pads are connected to bond fingers. There is further described a method for assigning bond pads of the die to associated supply rings and bond fingers of the package, as well as, a die having staggered bond pads formed in accordance with the method of the present invention.
Claims11
An integrated circuit package comprising:
- a substrate having a die cavity, first, second and third supply rings that surround the die cavity and a multiplicity of bond fingers located outside of the supply rings;
- a die mounted in the die cavity, the die having inner and outer bond pads, wherein at least some of the inner bond pads are staggered relative to the outer bond pads;
- and
- a multiplicity of bonding wires that electrically couple the inner and outer bond pads of the die to associated supply rings or bond fingers on the substrate, wherein all of the bonding wires that are coupled to the first, second or third supply rings are coupled to outer bond pads.
A die for assembly into an integrated circuit package having a plurality of supply rings surrounding a die cavity, and a plurality of signal bond fingers external to the supply rings, the die comprising:
- a plurality of outer bond pads, and
- a plurality of inner bond pads staggered relative to the outer bond pads, wherein all supplies are outer bond pads, and all staggered inner bond pads carry signals.
Dependencies are inferred from the claim text.