Semiconductor unit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHiroshi Yoshida, Hisashi Kawafuji
Life of this patent
Estimating the term…
Abstract
A semiconductor power module that can be downsized and is a malfunction-resistant is provided. In a semiconductor unit, a first circuit with a first semiconductor chip mounted on a first lead frame and a second circuit with a second semiconductor chip mounted on a second lead frame are sealed in a resin package. The first lead frame and the second lead frame are arranged to be overlapped. According to this arrangement, physical dimensions can be reduced as compared to a conventional semiconductor module in which no practical overlap exists. In addition, since the module is packaged using resin, the noise resistance of the semiconductor unit can be improved and malfunction can be still more reduced.
Claims13
A semiconductor unit comprising:
- a first circuit with a first semiconductor chip mounted on a first lead frame and a second circuit with a second semiconductor chip mounted on a second lead frame, which are sealed in a resin package,
- wherein the first lead frame and the second lead frame are arranged to be overlapped to each other.
A semiconductor unit comprising:
- a first circuit on which first three semiconductor chips are mounted on a first lead frame,
- a second circuit on which second three semiconductor chips for controlling the corresponding first three semiconductor chips are mounted on a second lead frame,
- a third circuit on which third three semiconductor chips are mounted on a third lead frame, and
- a fourth circuit on which fourth three semiconductor chips for controlling the corresponding third three semiconductor chips are mounted on a fourth lead frame,
- wherein the first, the second, the third and the fourth circuit are sealed in a resin package,
- wherein each of the first three semiconductor chips and each of the third three semiconductor chips are connected in series and form a 3-phase inverter as a switching element, and
- the first lead frame and the third lead frame are arranged to be overlapped.
A semiconductor unit comprising:
- a first circuit in which first two semiconductor chips are mounted on a first lead frame and a second circuit in which a second semiconductor chip is mounted on a second lead frame, which are sealed in a resin package,
- wherein the first lead frame is bent inside the resin package to form an overlap and the first two semiconductor chips are arranged to be opposite to each other.
Dependencies are inferred from the claim text.