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US 6,603,195 B1Granted
Planarized plastic package modules for integrated circuits
AssigneeInternational Business Machines Corporation
InventorsDavid V. Caletka, James L. Carper, John P. Cincotta, Kibby B. Horsford, Gary H. Irish, John J. Lajza, Jr., Gordon C. Osborne, Jr., Charles R. Ramsey, Robert M. Smith, Michael J. Vadnais
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Abstract
A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.
Claims16
A chip package, comprising:
- a semiconductor chip having contact pads;
- a lead frame having lead fingers on a first major plane extending from an edge of said chip package to a first level adjacent said contact pads, said lead fingers spaced at least a first distance from said contact pads;
- an encapsulant encapsulating said chip and a portion of said lead frame;
- and
- a tie bar within said encapsulant and spaced a second distance away from said chip, said tie bar comprising a bent portion for providing a major surface of said tie bar substantially parallel to said first major plane and in a spaced relation away from said first major plane, said major surface of said tie bar providing a force to prevent warpage of said chip package by balancing thermal stress between said lead fingers and said encapsulant.
2 more elements
Dependencies are inferred from the claim text.