Lead frame and method for fabricating resin-encapsulated semiconductor device using the same

A lead frame, comprising:

• an outer frame section;
• a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted;
• lead sections surrounding the chip mounting sections;
• connecting sections for connecting and supporting the
• lead sections and the outer frame section with each other;
• and an encapsulation region in which the chip mounting
• sections are encapsulated together in an encapsulation resin, wherein a depressed portion, which planar shape extends in the extension direction of the connecting sections, is provided in a plurality of regions of the outer frame section that are each located outside the encapsulation region, on a reverse side of a runner section along which the encapsulation resin flows, and along an extension of one of the connecting sections.

A lead frame, comprising:

• an outer frame section;
• a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted;
• lead sections surrounding the chip mounting sections;
• connecting sections for connecting and supporting the
• lead sections and the outer frame section with each other;
• and an encapsulation region in which the chip mounting
• sections are encapsulated together in an encapsulation resin,
• wherein a plurality of openings is provided in a plurality of regions of the outer frame section that are each located outside the encapsulation region and along an extension of one of the connecting notions.