US 6,603,193 B2 · Semiconductor package

Abstract

A semiconductor package having a molded body and a plurality of conductive pins that extend from the bottom of the molded body. The semiconductor package further includes a RF shield around a protected cavity that holds a first integrated circuit. The molded body can further include an unprotected plastic cavity for holding a second integrated circuit. The conductive pins form bonding pads that are used to electrically interconnect the first and second semiconductor devices to the external environment. A cover, beneficially comprised of copper, is disposed over the molded body. The plastic cavity beneficially includes a beveled wall that improves the routing of electrical conductors between the first integrated circuit and the second integrated circuit.

Claims47

Dependent claims

A leadless semiconductor package, comprising:

a body having a bottom, exterior walls, interior walls, and a first cavity;
an integrated circuit chip mounted on a side of said first cavity;
a plurality of conductive pins retained in said body, said plurality of conductive pins extending from said bottom of said body to form a plurality of electrical contacts, said conductive pins including a plurality of pads within said body;
and
a shield within said body and surrounding said cavity.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor package

Life of this patent

Semiconductor package

Life of this patent

Abstract

Claims47