Semiconductor device and method of manufacturing the same

A semiconductor device comprising:

• at least one semiconductor substrate including a front surface having a plurality of connection pads formed thereon, a back surface opposite to said front surface, and a side surface positioned between said front surface and said back surface;
• a front side protective film which has open portions exposing said plural connection pads formed on the front surface of said semiconductor substrate, and which is formed to cover said side surface and the front surface of said semiconductor substrate;
• a plurality of columnar electrodes which are formed on portions of said front side protective film on the front surface of said semiconductor substrate, and which are electrically connected to said plural connection pads;
• and
• a sealing film which is formed on a surface of said front side protective film, opposite to the front surface of said semiconductor substrate, between adjacent ones of said columnar electrodes.