Packaging micromechanical devices

Abstract

The specification describes a packaging arrangement for micro-electromechanical systems (MEMS). The MEMS devices are mounted on a ceramic platform and are then packaged in a hybrid package. The hybrid package may be hermetically sealed. The hybrid package uses a ceramic insert as the primary MEMS device enclosure. The ceramic insert is mounted on a polymer printed wiring board, which provides both support and electrical interconnection for the ceramic insert. Optical access to the MEMS device is through a transparent window that may be hermetically sealed to the ceramic insert. The use of a ceramic primary enclosure for the MEMS device array substantially eliminates thermomechanical instabilities and provides thermomechanical and hermetic performance for the elements that require it. The main interconnection and routing function, implemented using standard epoxy printed circuit technology, yields high interconnection versatility and performance at low cost.

Dependencies are inferred from the claim text.