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US 6,603,154 B2Granted
Semiconductor package and method of manufacturing semiconductor package
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsYoshinori Sakai, Kazuhiro Nobori, Kazuo Arisue
Life of this patent
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Abstract
A lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, thereby allowing the semiconductor to have a reduced temperature.
Claims10
A semiconductor package comprising:
- a power supply semiconductor having upper and lower surfaces;
- at least one first electrode connected to the upper surface of the power supply semiconductor;
- at least one second electrode connected to the upper surface of the power supply semiconductor;
- a lower electrode connected to the lower surface of the power supply semiconductor;
- a heat sink connected to the lower electrode;
- a plurality of first conductors connected to the first and second electrodes, respectively, wherein each of the first conductors has a spherical, convex, or rod-like shape;
- a first insulating section formed of an insulating resin for covering the semiconductor except at a connecting portion of each of the first conductors and a lower surface of the heat sink;
- and
- a plate-shaped second conductor connected to the connecting portions of the first conductors.
6 more elements
A semiconductor package comprising:
- a power supply semiconductor having upper and lower surfaces;
- at least one first electrode connected to the upper surface of the power supply semiconductor;
- at least one second electrode connected to the upper surface of the power supply semiconductor;
- a lower electrode connected to the lower surface of the power supply semiconductor;
- a heat sink connected to the lower electrode;
- a plurality of first conductors connected to the first and second electrodes, respectively, wherein each of the first conductors has a connecting portion and a spherical, convex, or rod-like shape;
- a plate-shaped second conductor connected to the connecting portions of the first conductors;
- and
- an insulating section formed of an insulating resin for covering the semiconductor, the heat sink, the first conductors, and the second conductor except at a lower surface of the heat sink and a connecting portion of the second conductor.
6 more elements
Dependencies are inferred from the claim text.