Semiconductor device

A semiconductor optical device comprising:

• a resin package including an upper surface integrally provided with a convex lens portion, a bottom surface opposite to the upper surface, a first side surface and a second side surface opposite to the first side surface, the resin package being capable of transmitting light;
• a semiconductor optical chip sealed in the resin package;
• a wire including a first end bonded to the semiconductor chip and a second end away from the first end;
• a first lead including a bent first inner terminal cup entering from the first side surface into the resin package and a first outer terminal connecting to the first inner terminal cup and exposed to outside of the resin package, the semiconductor chip being bonded to the first inner terminal cup;
• a second lead including a second inner terminal entering from the second side surface into the resin package and a second outer terminal connecting to the second inner terminal and exposed to outside of the resin package, the second end of the wire being bonded to the second inner terminal;
• and
• a covering member softer than the resin package and capable of transmitting the light;
• wherein the first inner terminal cup is provided with a recessed surface surrounding the semiconductor chip and facing the lens portion of the resin package, the recessed surface including a bottom portion for supporting the semiconductor chip and a slanted reflective portion flaring toward the lens portion for reflecting the light, the covering member filling the cup for covering the semiconductor chip;
• and
• wherein the covering member bulges convexly above the first inner terminal cup toward the lens portion.