Printed circuit board electrical interconnects
AssigneeMack Technologies Florida, Inc.
InventorRichard M. Biron
Life of this patent
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Abstract
A device used in the formation of interconnected printed circuit boards and the like, the device comprising a rigid dielectric layer; a window in the dielectric layer; and at least two interconnects. Each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window. A portion of the each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window. The interconnects do not cover the entire window.
Claims10
A device comprising:
- a rigid dielectric layer;
- a window in the dielectric layer;
- and
- at least two interconnects;
- wherein
- each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window;
- a portion of each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window;
- the at least two interconnects do not cover the entire window, and
- the device comprises at least two through holes extending through a first of the at least two interconnects and the dielectric layer, wherein one of the at least two through holes extends through the first segment of the first interconnect, and the second through hole extends through the second segment of the first interconnect.
A device comprising:
- a rigid dielectric layer;
- a window in the dielectric layer;
- and
- at least two interconnects;
- wherein
- each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window;
- a portion of each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window;
- the at least two interconnects do not cover the entire window;
- each of the at least two interconnects has the same relationships to the window, dielectric layer, and through holes and the same characteristics as the first interconnect;
- the dielectric layer comprises at least two segments forming at least two sides of the window;
- and
- the at least two segments of the dielectric layer are coupled together only by the at least two interconnects.
Dependencies are inferred from the claim text.