Making leadframe semiconductor packages with stacked dies and interconnecting interposer

A semiconductor package comprising:

• a metal leadframe including a die paddle and a plurality of leads;
• two semiconductor dies each having perimeter and bond pads adjacent said perimeter, wherein at least some of the bond pads of one or both of the semiconductor dies are electrically coupled to some of said leads;
• and
• an interposer comprising a dielectric layer and at least one metallic layer including circuit traces;
• wherein said semiconductor dies are stacked with the die paddle and the interposer between them, the bond pads of the two semiconductor dies are oriented in a same direction, and at least some of the bond pads of one said semiconductor die are electrically coupled to at least some of the bond pads of the other said semiconductor die through some of said circuit traces.

A semiconductor package comprising:

• a metal leadframe including a die paddle and a plurality of leads;
• two semiconductor dies each having perimeter and bond pads adjacent said perimeter, wherein at least some of the bond pads of one or both of the semiconductor dies are electrically coupled to some of said leads;
• and
• an interposer comprising a dielectric layer and at least one metallic layer including circuit traces;
• wherein said semiconductor dies are stacked with the die paddle and the interposer, the bond pads of the two semiconductor dies are oriented in a same direction, and at least one said bond pad of one said semiconductor die are electrically coupled to at least said bond pad of the other said semiconductor die through at least one wire bond and one said circuit trace.