Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board

A display device, comprising:

• an integrated circuit chip mounting flexible printed circuit board,
• wherein said integrated circuit chip mounting flexible printed circuit board including:
• a mounting region in a substantially quadrangular shape for mounting an integrated circuit chip;
• and
• a plurality of inner-leads, provided along each side of said mounting region, for being connected with bumps of said integrated circuit chip so that said integrated circuit chip is mounted and bonded in said mounting region,
• wherein said inner-leads are provided so as to have substantial equality between (a) a sum of areas of superimposing regions for said inner-leads provided on one of facing two sides and said bumps, and (b) a sum of areas of superimposing regions for said inner-leads provided on the other of said facing two sides and said bumps.

A flexible printed circuit board, comprising:

• a mounting region in a substantially quadrangular shape for mounting an integrated circuit;
• and
• a plurality of inner-leads extended into said mounting region, provided in such a manner that at least one of pairs of facing two sides of said mounting region are respectively provided with said inner-leads, which are for connection with bumps of said integrated circuit chip via an anisotropic conductive material, in different numbers from each other,
• wherein said inner-leads are provided so as to have substantial equality between (a) a sum of areas of superimposing regions of said inner-leads provided on one of facing two sides of the mounting region, and (b) a sum of areas of superimposing regions of said inner-leads provided on the other of the facing two sides, where said superimposing regions of said inner-leads are regions located on said inner-leads, in which said bumps and said inner-leads are superimposed each other when said integrated circuit chip is mounted.

An integrated circuit chip mounted structure, produced by mounting an integrated circuit chip on a mounting region of a flexible printed circuit board,

• wherein said flexible printed circuit board, including:
• a mounting region in a substantially quadrangular shape for mounting an integrated circuit chip;
• and
• a plurality of inner-leads extended into said mounting region, provided in such a manner that at least one of pairs of facing two sides of said mounting region are respectively provided with said inner-leads, which are for connection with bumps of said integrated circuit chip via an anisotropic conductive material, in different numbers from each other,
• wherein said inner-leads are provided so as to have substantial equality between (a) a sum of areas of superimposing regions of said inner-leads provided on one of facing two sides of the mounting region, and (b) a sum of areas of superimposing regions of said inner-leads provided on the other of the facing two sides, where said superimposing regions of said inner-leads are regions located on said inner-leads, in which said bumps and said inner-leads are superimposed each other when said integrated circuit chip is mounted,
• wherein (1) inner-leads provided on said flexible printed circuit board, and (2) bumps formed on said integrated circuit chip, are respectively connected each other via an anisotropic conductive material.

A flexible printed circuit board, comprising:

• a mounting region in a substantially quadrangular shape for mounting an integrated circuit chip by using an anisotropic conductive material;
• and
• a plurality of inner-leads extended into said mounting region, provided in such a manner that at least one of pairs of facing two sides of said mounting region are respectively provided with said inner-leads, which are for connection with bumps of said integrated circuit chip via an anisotropic conductive material, in different numbers from each other,
• wherein said inner-leads are provided to have substantial equality between (a) a sum of widths of said inner-leads provided on the one of said facing two sides, and (b) a sum of widths of said inner-leads provided on the other of said facing two sides.

An integrated circuit chip mounted structure, produced by mounting an integrated circuit chip on a mounting region of a flexible printed circuit board, via connecting inner-leads of said flexible printed circuit board and bumps of said integrated circuit chip,

• wherein said flexible printed circuit board, including:
• a mounting region in a substantially quadrangular shape, for mounting an integrated circuit chip by using an anisotropic conductive material;
• and
• a plurality of said inner-leads extended into said mounting region, provided in such a manner that at least one of pairs of facing two sides of said mounting region are respectively provided with said inner-leads, which are for connection with said bumps of said integrated circuit chip via an anisotropic conductive material, in different numbers from each other,
• wherein said inner-leads are provided to have substantial equality between (a) a sum of widths of said inner-leads provided on the one of said facing two sides, and (b) a sum of widths of said inner-leads provided on the other of said facing two sides,
• wherein (1) inner-leads provided on said flexible printed circuit board, and (2) bumps formed on said integrated circuit chip, are respectively connected each other via an anisotropic conductive material.

A bonding method of an integrated circuit chip mounting flexible printed circuit board, comprising steps of:

• forming a plurality of inner-leads, provided along each side of a mounting region in a substantially quadrangular shape for mounting an integrated circuit chip;
• and
• connecting said inner-leads with bumps of said integrated circuit chip, so that said integrated circuit chip is mounted and bonded in said mounting region,
• wherein the forming of the inner-leads are carried out so that said inner-leads have substantial equality between (a) a sum of areas of superimposing regions for said inner-leads provided on one of facing two sides and said bumps, and (b) a sum of areas of superimposing regions for said inner-leads provided on the other of said facing two sides and said bumps.