Photosensitive insulating paste and thick film multi-layer circuit substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorsMakoto Tose, Hiromichi Kawakami, Shizuharu Watanabe
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Abstract
A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.
Claims17
A thick-film multi-layer circuit substrate comprising the combination of an insulating substrate and a thick-film insulating layer wherein the insulating layer is an exposed and sintered photosensitive insulating paste comprising a borosilicate glass powder and a crystalline SiO2 powder dispersed in a photosensitive organic vehicle, and wherein the sintered paste contains about 3-40 wt. % crystalline SiO2.
Dependencies are inferred from the claim text.