System and method for analyzing a semiconductor surface
AssigneeMicron Technology, Inc.
InventorsTerry L. Gilton, Troy R. Sorensen
Life of this patent
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Abstract
A method and apparatus for analyzing a semiconductor surface obtains a sample from a localized section of a wafer. The sample is obtained by isolating a section of a wafer with a sampling apparatus, dispensing liquid onto the isolated section of the wafer, dissolving compounds of interest in the liquid, removing a portion of the liquid, and analyzing the liquid and dissolved compounds of interest. The liquid can be an etching solution, an organic solvent, or other suitable solvent. Samples and analyses can, thus, be obtained as a function of position on the wafer. Analyses as a function of depth can also be determined by sampling and analyzing an isolated portion of the wafer as a function of time.
Claims14
A method for sampling and analyzing a selected area of a semiconductor wafer, the method comprising:
- selecting a portion of the semiconductor wafer;
- positioning a first tube directly above the selected portion of the semiconductor wafer;
- dispensing a liquid through the first tube onto the selected portion of the semiconductor wafer, the liquid selected to dissolve at least materials on the semiconductor wafer;
- retaining the liquid within a second tube defining an isolated portion of the semiconductor wafer, the isolated portion being greater than the selected portion and less than an entire surface of the semiconductor wafer;
- peristaltically pumping at least a portion of the liquid from within the second tube to an analyzer using a peristaltic pump coupled to the second tube;
- and
- analyzing the liquid in the analyzer.
A method for evaluating a portion of a wafer, the method comprising:
- positioning a first tube above a selected portion of the wafer in close proximity of a surface of the wafer;
- dispensing an etchant through the first tube onto a selected portion of the wafer;
- retaining the etchant within a second tube defining an isolated section of the wafer, the isolated section being greater than the selected portion and less than an entire surface of the wafer;
- peristaltically pumping a portion of the etchant from within the second tube and the isolated section of the wafer to an analyzer using a peristaltic pump coupled to the second tube;
- and
- analyzing the etchant as a function of time.
Dependencies are inferred from the claim text.