Encapsulation of microelectronic assemblies

A method of making microelectronic assemblies comprising:

• (a) securing at least one packaged chip over a substrate;
• (b) electrically interconnecting said packaged chip and said substrate;
• (c) securing a dam over said substrate, wherein said dam surrounds the at least one packaged chip secured to said substrate;
• (d) applying a cover layer over said dam and over the at least one packaged chip so as to define an enclosed air-tight space surrounding said at least one packaged chip;
• (e) introducing a curable liquid encapsulant into the enclosed space;
• and
• (f) curing said curable liquid encapsulant, wherein a top surface of said substrate, said dam and said cover layer retain said curable liquid encapsulant in the enclosed space during the introducing a curable liquid encapsulant step.

A method of encapsulating microelectronic assemblies comprising:

• (a) securing one or more packaged chips over a substrate;
• (b) electrically interconnecting said one or more packaged chips and said substrate;
• (c) securing a dam over said substrate, wherein said dam surrounds the one or more packaged chips secured to said substrate;
• (d) applying a cover layer over said dam and over the one or more packaged chips so as to define an enclosed air-tight space surrounding said at least one packaged chip;
• (e) evacuating the enclosed space;
• (f) after the evacuating the enclosed space, introducing a curable liquid encapsulant into the enclosed space;
• and
• (g) curing said curable liquid encapsulant, wherein a top surface of said substrate, said dam and said cover layer retain said curable liquid encapsulant in the enclosed space during the introducing a curable liquid encapsulant step.