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US 6,602,738 B2Granted
Method of manufacturing semiconductor device having tie bars for interconnecting leads
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsZhikang Qin, Namiki Moriga
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Abstract
A semiconductor element is first fixed on a frame. The semiconductor element and a plurality of leads are connected together. The semiconductor element is sealed with molding resin, to thereby fabricate a package having a length per side of 14 mm or more. After tie bars interconnecting a plurality of leads have been cut, a package is subjected to heat treatment at a predetermined temperature.
Claims9
A method of manufacturing a semiconductor device comprising the steps of:
- fixing a semiconductor element on a frame;
- connecting the semiconductor element with a plurality of leads;
- sealing the semiconductor element with molding resin, to thereby fabricate a package having a length per side of 14 mm or more;
- cutting tie bars interconnecting the plurality of leads;
- and
- subjecting the package to heat treatment at a predetermined temperature after cutting of the tie bars.
3 more elements
Dependencies are inferred from the claim text.