Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips

A method of fabricating a semiconductor chip package, comprising:

• forming a frame body of a lead frame with least two chip-receiving windows, a plurality of internal connection leads adjacent to the chip-receiving windows, and a plurality of external connection leads adjacent to at least one of the chip-receiving windows;
• providing at least two integrated circuit chips, and placing each of the integrated circuit chips in a respective one of the chip-receiving windows, wherein the integrated circuit chip in at least one of the chip-receiving windows is a master integrated circuit chip, and the integrated circuit chip in other one of the chip-receiving windows is a slave integrated circuit chip, wherein the master integrated circuit chip includes an embedded testing circuit to permit testing of the slave integrated circuit chip that is connected thereto during a testing process of the semiconductor chip package;
• connecting electrically the internal connection leads to bonding pads on the integrated circuit chips in the chip-receiving windows to establish internal electrical connection among the integrated circuit chips;
• and
• connecting electrically the external connection leads to the bonding pads on the integrated circuit chip in said at least one of the chip-receiving windows, the external connection leads serving as terminal pins such that external electrical connection with the integrated circuit chip in said at least one of the chip-receiving windows is established via the external connection leads and wherein the slave chip is not directly connected to the external connection leads.