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US 6,602,726 B1Granted
Bond surface conditioning system for improved bondability
AssigneeTexas Instruments Incorporated
InventorsSean Michael Malolepszy, Peter J. Sakakini
Life of this patent
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Abstract
Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).
Claims6
A method of conditioning interconnect surfaces of a support structure comprising:
- forming interconnect surfaces on the support structure;
- positioning said support structure board in alignment with a personality kit such that the interconnect surfaces are substantially aligned with raised bosses on said personality kit;
- clamping said personality kit onto said support structure such that the raised bosses forcibly engage with and deform each interconnect surface on said support structure substantially simultaneously;
- and
- de-clamping said personality kit from said support structure.
2 more elements
Dependencies are inferred from the claim text.