Flexible printed circuit board with reinforcing plate
AssigneeNitto Denko Corporation
InventorsKyouyuu Jo, Yasufumi Miyake
Life of this patent
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Abstract
A flexible printed circuit board with a reinforcing plate, which comprises: a flexible printed circuit board including i) a conductive circuit pattern layer, and ii) an insulating layer made of a plastic film; a reinforcing plate; and an adhesive layer so that the reinforcing plate is attached to the flexible printed circuit board via the adhesive layer, wherein the adhesive layer is formed from an adhesive composition containing a composite metal hydroxide represented by formula (1): M1-xQx(OH)2 (1) wherein M is at least one metal atom selected from the group consisting of Mg, Ca, Sn and Ti; Q is at least one metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn; and x is a positive number from 0.01 to 0.5.
Claims7
A flexible printed circuit board with a reinforcing plate, which comprises:
- a flexible printed circuit board including i) a conductive circuit pattern layer, and ii) an insulating layer made of a plastic film;
- a reinforcing plate;
- and
- an adhesive layer so that the reinforcing plate is attached to the flexible printed circuit board via the adhesive layer,
- wherein the adhesive layer is formed from an adhesive composition containing a composite metal hydroxide represented by formula (1):
- M1-xQx(OH)2 (1)
- wherein M is at least one metal atom selected from the group consisting of Mg, Ca, Sn and Ti;
- Q is at least one metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn;
- and x is a positive number from 0.01 to 0.5, wherein the conductive pattern is formed on one side of the flexible printed circuit board, and the reinforcing plate is attached on the other side of the flexible printed circuit board via the adhesive layer using the adhesive composition containing the composite metal hydroxide represented by the formula (1).
Dependencies are inferred from the claim text.