Liquid crystalline polymer bond plies and circuits formed therefrom
AssigneeWorld Properties, Inc.
InventorsMichael E. St. Lawrence, Scott Kennedy
Life of this patent
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Abstract
A multi-layer circuit board comprises a liquid crystalline polymer bond ply disposed between two circuit layers wherein the liquid crystalline polymer bond ply is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/° C. and further wherein the multi-layer circuit is formed by lamination at a temperature of 0° C. to about 10° C. less than the melt temperature of the liquid crystalline polymer.
Claims10
A multi-layer circuit comprising
- a first circuit layer;
- a second circuit layer;
- and
- a liquid crystalline polymer bond ply disposed between the first and the second circuit layers, wherein
- the liquid crystalline polymer band ply is formed by treating a film comprising
- a liquid crystalline polymer with an amount of heat and pressure effective to produce
- a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.;
- wherein the multi-layer circuit is formed by laminating the first circuit layer, the second circuit layer, and the film at a temperature from 0° C. to about 15° C. less than the melt temperature of the liquid crystalline polymer bond ply.
A multi-layer circuit comprising
- a first conductive metal layer;
- a first circuit layer comprising a first dielectric layer and a first conductive circuit layer;
- a first liquid crystalline polymer bond ply disposed between the conductive metal layer and the first conductive circuit layer of the first circuit layer;
- a second conductive metal layer;
- and
- a second liquid crystalline polymer bond ply disposed between the dielectric layer of the first circuit layer and the second conductive metal layer, wherein
- the liquid crystalline polymer bond plies are formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.;
- and
- further wherein
- the multi-layer circuit board is formed by laminating the layers and the treated films at a temperature from 0° C. to about 15° C. less than the melt temperature of the liquid crystalline polymer bond plies.
Dependencies are inferred from the claim text.