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US 6,602,446 B2Granted
Electrically conductive paste and method of forming circuit
AssigneeYazaki Corporation
InventorHitoshi Ushijima
Life of this patent
Estimating the term…
Abstract
An electrically conductive paste is provided in that complexes A each made up of an electrically conductive filler 1 and a heating element 3 adapted to generate heat on electromagnetic induction are compounded with a resin 5.
Claims2
An electrically conductive paste comprising:
- complexes made up by mixing an electrically conductive filler and a heating element adapted to generate heat by electromagnetic induction, said heating element being securely connected to said conductive filler;
- and
- a resin mixed with the complexes.
A method of forming a circuit comprising the steps of:
- mixing an electrically conductive filler and a heating element adapted to generate heat on electromagnetic induction to form complexes in which said heating element is securely connected to said conductive filler;
- mixing the complexes with a resin to form electrically conductive paste to form a circuit pattern;
- curing the circuit pattern by electromagnetic induction.
Dependencies are inferred from the claim text.