Structure for polymeric thermistor and method of making the same
AssigneeProtectronics Technology Corporation
InventorChen-Ron Lin
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Abstract
A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.
Claims10
A method for manufacturing a structure for polymeric thermistor device, comprising the steps of:
- providing a polymeric substrate;
- mixing conductive particles into the polymeric substrate, such that the polymeric substrate mixed with the conductive particles turns into a filled composite;
- cross-linking the filled composite;
- and
- performing a shearing process to the cross-linked filled composite to make the strain of the filled composite be more than 1% such that the conductive particles aligned in a direction turn into conductive particles having a discontinuous phase aligned in a single direction from an original conductive continuous phase.
A method for manufacturing a structure for polymeric thermistor device, comprising the steps of:
- providing a composite that is mixed with conductive particles;
- cross-linking the composite that is mixed with the conductive particles;
- and
- performing a shearing process to the cross-linked composite, such that the conductive particles in the composite form a discontinuous phase in a direction.
Dependencies are inferred from the claim text.