Methods for finishing microelectronic device packages

A method for simultaneously finishing a molded surface of a protective resin package on each of a plurality of microelectronic devices carried on a common substrate, comprising:

• simultaneously abrading at least a portion of the molded resin surface of each of the packages by pressing the surface of each package against an abrasive media and imparting motion to the common substrate and/or the abrasive media to rub the package surfaces against the abrasive media and remove a portion of the package;
• cutting the common substrate to separate the microelectronic devices from one another after terminating the abrasion of the molded resin surface;
• and
• cleaning residual materials from at least a portion of the packages after terminating the abrasion of the molded resin surface.

A method for packaging a microelectronic device, the package having a uniformly textured and colored surface, comprising:

• molding package compound at least partially around a microelectronic die in a mold to at least partially encase the microelectronic die, leaving a surface blemish on a marking surface of the mold compound;
• removing the package compound from the mold;
• prior to marking the marking surface, abrading at least a portion of the marking surface by engaging an abrasive media with the marking surface;
• terminating the abrasion when the surface blemish has been at least partially removed from the package;
• and
• marking the abraded marking surface after terminating the abrasion.

A method for forming protective packaging on microelectronic devices, comprising:

• molding a protective resin package at least partially around each of a plurality of microelectronic dies in a mold to at least partially encase each microelectronic die, leaving a surface blemish on a primary marking surface of at least one of the packages;
• removing the packages from the mold;
• identifying the at least one package having the surface blemish on its primary marking surface;
• and
• altering at least a portion of the surface blemish by changing the primary marking surface.

A method for packaging a microelectronic die carried on a substrate, comprising:

• molding package compound at least partially around a microelectronic die in a mold to at least partially encase the microelectronic die, leaving a portion of the substrate exposed and leaving a surface blemish on a marking surface of the package compound;
• removing the resulting package from the mold;
• prior to marking the marking surface, positioning a masking member at least adjacent to a portion of the substrate such that the marking surface is not covered by the masking member;
• prior to marking the marking surface, abrading at least a portion of the marking surface by engaging an abrasive media with the marking surface;
• terminating the abrasion when the surface blemish has been at least partially removed from the package;
• and
• marking the abraded marking surface after terminating the abrasion.