Method of manufacturing ceramic electronic components

A method of manufacturing a ceramic electronic component comprising:

• a first step of providing a plurality of ceramic sheets having a porosity of 30% or more and comprising ceramic powder and polyethylene, and a conductor layer containing metal powder, resin and plasticizer formed on a base film,
• a second step of stacking the plurality of ceramic sheets and then laminating and pressurizing the conductor layer together with the base film on the stack of ceramic sheets, and peeling off the base film to form a ceramic sheet with conductor layer,
• a third step of laminating the stack of ceramic sheets with the conductor layer laminated thereon to form a laminated body, and
• a fourth step of sintering the laminated body.

A method of manufacturing a ceramic electronic component comprising:

• a first step of providing a plurality of ceramic sheets having a porosity of 30% or more and comprising ceramic powder and polyethylene, and providing a plurality of conductor layers, each conductive layer containing metal powder, resin and plasticizer formed on a base film,
• a second step of stacking a plurality of the plurality of ceramic sheets, a third step of disposing one of the plurality of ceramic sheets on an upper surface of the stack of ceramic sheets,
• a fourth step of laminating and pressurizing one of the plurality of conductor layers together with a base film on the disposed ceramic sheet, and peeling off the base film to form a ceramic sheet with conductor layer,
• a fifth step of repeating the third step and fourth step to form a laminated body having a desired number of layers, and
• a sixth step of sintering the laminated body.