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US 6,602,354 B2Granted
Method for producing a tin-nickel alloy film
AssigneeSuzuka National College of Technology
InventorsHideyuki Kanematsu, Tatsumasa Kobayashi, Takeo Oki
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Abstract
A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, the multilayered film is heated to a given temperature to form a tin-nickel alloy film through the diffusion of the tin elements of the tin layer into the nickel layer.
Claims4
A method for producing a tin-nickel alloy film comprising the steps of:
- depositing a tin layer and a nickel layer on a given substrate sequentially, thereby to form a multilayered film composed of the tin layer and the nickel layer wherein the thickness of the tin layer is 10-50 μm, and the thickness of the nickel layer is 10-50 μm, and
- heating the multilayered film in a furnace at a temperature not less than the melting point of tin to form the tin-nickel alloy film having Ni3Sn phase, Ni3Sn2 phase and Ni3Sn4 phase.
A method for producing a tin-nickel alloy film comprising the steps of:
- depositing a tin layer and a nickel layer on a given substrate sequentially, thereby to form a multilayered film composed of the tin layer and the nickel layer wherein the thickness of the tin layer is 10-50 μm, and the thickness of the nickel layer is 10-50 μm, and
- heating the multilayered film in a furnace at a given temperature to form the tin-nickel alloy film having Ni3Sn phase, Ni3Sn2 phase and Ni3Sn4 phase.
Dependencies are inferred from the claim text.