Finishing pad design for multidirectional use
AssigneeInfineon Technologies AG
InventorMarkus Naujok
Life of this patent
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Abstract
A polishing pad (for example, polishing pad 305) for use in polarization of a semiconductor wafer (for example, semiconductor wafer 420), the polishing pad 305 featuring a plurality of different polishing surfaces, depending upon the direction of the movement of the polishing pad 305. The polishing pad 305 may take the form of a polishing disc or a polishing belt. The polarization of the semiconductor wafer 420 can then take place at a fewer number of polishing stations, thereby reducing the amount of time needed and reducing the probability of damage to the semiconductor wafer 420.
Claims16
A polishing pad for use in polarization of semiconductor wafers comprising:
- a polishing pad surface;
- a series of multifaceted appendages formed on the polishing pad surface, wherein each of the multifaceted appendages having a facet arranged orthogonal to a direction of movement of the polishing pad, and wherein each facet of the multifaceted appendages has an abrasive surface property, with each abrasive surface property of a single multifaceted appendage having a different abrasive property quality.
Dependencies are inferred from the claim text.