Pad support apparatus for chemical mechanical planarization
AssigneeStrasbaugh
InventorDavid G. Halley
Life of this patent
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Abstract
A system for chemical mechanical planarization comprises a platen assembly for holding an object to be planarized and a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad. The polishing pad is smaller in surface area than the object. The polishing head is movable from a first region overlying the platen assembly to a second region. The puck holder assembly comprises a backing surface for positioning the substrate, and a clamp ring positioned proximate to the backing surface for supplying mechanical force to the substrate to hold the substrate in place during a polishing operation. A spring mechanism is disposed in the housing for resiliently biasing the clamp ring toward the substrate.
Claims13
A chemical mechanical planarization apparatus comprising:
- a housing including a backing surface for positioning a substrate holding a polishing pad which is smaller in surface area than an object to be planarized by the polishing pad in a polishing operation;
- a clamp ring positioned in the housing proximate to the backing surface and being movable between a contracted position to clamp the perimeter of the substrate and an expanded position to release the substrate;
- and
- a spring mechanism disposed in the housing for resiliently biasing the clamp ring toward the contracted position.
A system for chemical mechanical planarization, the system comprising:
- a platen assembly for holding an object to be planarized;
- and
- a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad which is smaller in surface area than the object, the polishing head being movable from a first region overlying the platen assembly to a second region;
- wherein the puck holder assembly comprises a backing surface for positioning the substrate, and a clamp ring positioned proximate to the backing surface for supplying mechanical force to the substrate to hold the substrate in place during a polishing operation.
Dependencies are inferred from the claim text.