Substrate retaining ring
AssigneeApplied Materials, Inc.
InventorJohn Prince
Life of this patent
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Abstract
A retaining ring is configured for use with an apparatus for polishing a substrate. The substrate has upper and lower faces and a perimeter. The apparatus has a movable polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retaining ring has a retaining face for engaging and retaining the substrate against lateral movement and a bottom face for contacting the polishing surface of the polishing pad. The bottom face of the retaining ring extends downward from an inner portion adjacent the retaining face to a lowermost portion radially outboard of the retaining face.
Claims8
A method of chemical mechanical polishing, comprising:
- bringing a first surface of a substrate into contact with a polishing surface;
- bringing a first region and a second region of a non-planar bottom surface of a retaining ring that surrounds the substrate into contact with the polishing surface, wherein the second region comprises an annular region projecting substantially outward relative to the bottom surface and the first region;
- applying pressure to the retaining ring so as to substantially bring the first region into alignment with the first surface of the substrate;
- and
- causing relative motion between the substrate and the polishing surface.
Dependencies are inferred from the claim text.