Automated polishing apparatus and method of polishing

An apparatus for polishing a surface of a substrate, comprising:

• a polishing spindle assembly adapted to support a rotating polishing tool and operable to move in at least one of a direction toward and away from the substrate to contact the polishing tool on the surface of the substrate with a predetermined torque on the polishing tool during a polishing cycle, said polishing spindle assembly comprising a spindle housing, a spindle mounted for rotation within said spindle housing and operable to receive the polishing tool, and a spindle motor operatively connected to said spindle for rotating said spindle during a polishing cycle, said spindle motor having a motor housing operatively connected to said spindle housing;
• a positioning mechanism operatively connected to said polishing spindle assembly and operable to move said polishing spindle assembly toward and away from the substrate;
• a torque sensor operatively connected to said spindle housing and said motor housing and operable to sense a torque on the polishing tool during the polishing cycle, said torque sensor being operable to sense a relative torque between said spindle housing and said motor housing that corresponds to a torque on the polishing tool during the polishing cycle;
• and
• a control operatively coupled to said positioning mechanism and said torque sensor, said control being responsive to the torque sensed by said torque sensor to adjust positioning of said polishing spindle assembly in at least one of a direction toward and away from the substrate to maintain the torque on the polishing tool substantially constant during the polishing cycle.