Method of connecting circuit boards
AssigneeDenso Corporation
InventorsToshihiro Miyake, Yoshitaro Yazaki
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Abstract
The invention provides metal connecting composition for connecting metal to metal with removing oxide film on the mother metal surface. The metal connecting composition contains metal particles and hydrocarbon compound having C—H bonding dissociation energy of a value equal to or lower than 950 KJ/mol. When metal pieces between which the metal connecting composition is applied is heated, the hydrocarbon compound is dehydrogenated to form radical, and the radical reduces oxide film on the metal surface to be connected.
Claims3
A metal connecting composition comprising metal particles and a hydrocarbon compound having C—H bonding dissociation energy of a value equal to or lower than 950 KJ/mol, wherein the hydrocarbon compound is selected from a group consisting of cyclo-octane, tetramethyl-pentadecane, triphenylmethane, dicyclo-pentadiene, and dihydroanthracene.
A metal connecting composition comprising metal particles and a hydrocarbon compound having C—H bonding dissociation energy of a value equal to or lower than 950 KJ/mol, wherein the value of the C—H bonding dissociation energy is between 890 KJ/mol and 950 KJ/mol inclusive.
Dependencies are inferred from the claim text.