Void-free die attachment method with low melting metal

A system for attaching an electronic die to a substrate, the system comprising:

• a pad of low temperature die attachment material placed within a die attachment area on the substrate, wherein the die attachment material changes phase at elevated die temperatures, and wherein the die is positioned over the pad and a compression force is applied to the die directed towards the substrate to expel air trapped within the pad;
• a bead of containment material applied to the substrate to define the die attachment area to contain the die attachment material therein, wherein the bead of containment material is a bead of epoxy;
• and
• a die cover for enclosing the die to create a hermetically sealed environment, wherein air is expelled from between the die cover and the substrate by injecting a gas therebetween.

A method for attaching an electronic die to a substrate, the method comprising:

• depositing a pad of low temperature die attachment material within a die attachment area, the die attachment material being adapted to change phases;
• positioning the die over the pad;
• clamping the die to the substrate to expel air trapped within the pad
• dispensing a bead of containment material onto the substrate to define the die attachment area to contain the pad of low temperature die attachment material, wherein the bead of containment material is a bead of epoxy, and wherein the pad of low temperature die attachment material is a pad of low temperature solder;
• enclosing the die under a die cover;
• and
• expelling air under the die cover by injecting a gas from between the die cover and the substrate.

A method for attaching an electronic die to a substrate, the method comprising:

• depositing a pad of low temperature die attachment material within a die attachment area, wherein the pad is a pad of low temperature solder;
• positioning the die over the pad;
• applying a spring force against the die directed toward the substrate using a compression spring to expel air trapped within the pad;
• dispensing a bead of containment material onto the substrate to define the die attachment area and to contain the pad, wherein the bead is a bead of epoxy;
• enclosing the die under a die cover;
• and
• expelling air from within the die cover by injecting a gas between the die cover and the substrate.

A system for attaching an electronic die to a substrate, the system comprising:

• a pad of low temperature die attachment material placed within a die attachment area, the die attachment material being adapted to change phases;
• a clamp for contacting the die and securing the die to the substrate thereby exerting a downward force on the die to expel air trapped within the pad;
• a bead of containment material dispensed onto the substrate to define the die attachment area, wherein the bead is a bead of epoxy;
• and
• a die cover for creating a hermetically sealed container for containing the die, wherein air is expelled from between the die cover and the substrate by injecting a gas into the die cover.

A system for attaching an electronic die to a substrate, the system comprising:

• a pad of low temperature die attachment material placed within a die attachment area, wherein the pad is a pad of low temperature solder;
• a spring for exerting a force against the die directed toward the substrate to expel air trapped within the pad;
• a bead of containment material dispensed onto the substrate to define a die attachment area, wherein the bead is a bead of epoxy;
• and
• a die cover for enclosing the die to create a hermetic seal, wherein air is expelled from between the die cover and the substrate by injecting a gas into the die cover.