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US 6,601,752 B2Granted
Electronic part mounting method
AssigneeDenso Corporation
InventorsYukihiro Maeda, Yuji Ootani, Tetsuo Nakano, Takashi Nagasaka
Life of this patent
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Abstract
At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.
Claims20
An electronic part mounting method comprising the steps of:
- disposing a conductive jointing material on a portion of a surface of a substrate, the substrate having a first wiring on the surface thereof;
- mounting an electronic part on the portion of the substrate through the conductive jointing material;
- wire-bonding the electronic part to the first wiring through a wire;
- and
- prior to the disposing of the conductive jointing material, disposing a metal pad on an area of the first wiring where the wire is bonding.
2 more elements
Dependencies are inferred from the claim text.