Three-dimensional structure transfer method and apparatus
AssigneeFujitsu Limited
InventorsOsamu Toyoda, Akira Tokai, Motonari Kifune, Keiichi Betsui
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Abstract
A method for transferring a three-dimensional structure onto a substrate, which includes filling a plurality of concaves arranged on a sheet-form mold with a paste-like structural material, temporarily fixing the mold to a support member, contact-bonding the structural material in a state in which the structural material has the adhesion property or bonding property to the substrate together with the mold, releasing the temporary fixation of the mold by the support member after the contact-bonding, and removing the mold from the substrate, thereby transferring a three-dimensional structure onto the substrate.
Claims5
A three-dimensional structure transfer apparatus comprising:
- a delivery mechanism for delivering a sheet-form mold having a plurality of concaves arranged thereon, the concaves being filled with a structural material having an adhesion property or a bonding property;
- a support member for temporarily fixing the mold delivered by the delivery mechanism;
- a stage for mounting a substrate and moving the position of the substrate in parallel with the support member, thereby aligning the mold with the substrate;
- a roll press mechanism for, after aligning the mold with the substrate, pressing a back face of the mold with a roller, thereby contact-bonding the structural material in a state in which the structural material has an adhesion property or a bonding property to the substrate together with the mold;
- a release mechanism for releasing the temporary fixation of the mold after the pressing by the roll press mechanism;
- and
- a removing mechanism for removing the mold from the substrate.
Dependencies are inferred from the claim text.