Method for making a packaged semiconductor device
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Mark S. Johnson
Life of this patent
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Abstract
A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink is affixed to a surface of the die by way of a thermally compliant material. The compliant material reduces the stresses caused by temperature fluctuations which cause the heat sink and the die to expand and contract at different rates. A first molding material is deposited around the periphery of the die, compliant material and heat sink, thereby leaving exposed substantially an entire surface of the heat sink.
Claims12
A method for packaging a semiconductor device, comprising:
- affixing a heat sink directly to a die located on a substrate, said substrate including an opening and said heat sink including a planar and substantially rectangular surface;
- encapsulating said die and said heat sink with a first molding material such that said surface of said heat sink remains exposed;
- and
- encapsulating said opening with a second molding material.
Dependencies are inferred from the claim text.