Method of making an electromagnetic interference shield device

A method of packaging a device comprising:

• providing a substrate including a common voltage plane and a mounting region, the device mounted to the mounting region;
• providing an electrically conductive dam structure disposed on a surface of the substrate, the electrically conductive dam structure electrically coupled to the common voltage plane and circumscribing a perimeter of the mounting region;
• providing an electrically insulating encapsulant at least partially filling a pocket defined by the substrate and the electrically conductive dam structure, the electrically insulating encapsulant contacting the electrically conductive dam structure;
• and
• providing an electrically conductive encapsulant overlying the electrically insulating encapsulant, the electrically conductive encapsulant coupled to the electrically conductive dam structure;
• curing the electrically conductive encapsulant, the electrically insulating encapsulant, and the electrically conductive dam structure;
• floating a voltage on the common voltage plane.