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US 6,601,281 B1Granted
Method for molding substance on substrate and device formed thereby
AssigneeHigh Tech Computer, Corp.
InventorChien-Hung Chen
Life of this patent
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Abstract
A method for molding a molded substance to a substrate is provided. A substrate connected to a fixing portion by a connecting portion is prepared. The substrate is placed in a mold, wherein a portion of the fixing portion is protruding from the mold. The fixing portion is fixed by a fixing device outside the mold. Then, the molded substance covering the substrate is formed within the mold.
Claims17
A method for molding a molded substance to substrate, comprising;
- preparing said substrate connected to a fixing portion by a connecting portion;
- placing said substrate in a mold, wherein a portion of said fixing portion is protruding from said mold;
- fixing said fixing portion by a fixing device outside said mold;
- executing a molding process in said mold to form said molding substance covering said substrate;
- and removing said fixing portion from said substrate and said molded substance.
2 more elements
A method for molding a first substance to a second substance;
- comprising steps of:
- preparing said second substance, wherein said second substance is connected to a plurality of fixing portions;
- placing said second substance in a mold, wherein said plurality of fixing portions are protruding from said mold;
- fixing said second substance by fixing said plurality of fixing portions;
- injecting a material of said first substance into said mold to form said first substance on said second substance;
- and forming a hole on said first substance when a first fixing portion is separate from said second substance, and wherein said method further comprises a step of filling up said hole with a filling substance.
3 more elements
Dependencies are inferred from the claim text.