Process for mounting device and optical transmission apparatus

Abstract

An optical transmission apparatus applicable to an optical interconnection apparatus for interconnection between stacked IC chips, and a process of mounting elements for manufacturing such an apparatus are disclosed. For example, light emitting elements (2a, 2b), each having a surface emitting laser of a different wavelength, are respectively formed on trapezoidal microstructures (7a, 7b) having different sizes, and light receiving elements (3a, 3b), each having a filter for receiving light in the wavelength range of each light emitting element, are respectively formed on trapezoidal microstructures (8a, 8b) having different sizes. On substrates (4a to 4c) having concave portions (5a, 5b, 6a, 6b) which have forms identical to those of the microstructures and are formed at positions where the light emitting and receiving elements are provided, a slurry including the microstructures is made to flow, thereby each microstructure is fit into the corresponding concave portion due to gravity.

Dependencies are inferred from the claim text.