The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an energy enhanced process to deposit a silicate containing coating or film upon a metallic or conductive surface.
Drawings
Claims10
A product comprising a zinc substrate having a surface treated to improve corrosion resistance wherein said product is formed by a method comprising:
exposing at least a portion of the substrate to a medium comprising a combination comprising at least one polar carrier and at least one silicate that is soluble within said carrier wherein said medium has a basic pH,
introducing an energy source into said first medium thereby treating the surface by forming a first layer comprising at least one silicate and a second layer upon the first layer comprising silica, and;
recovering the surface from the medium.
An article comprising an electrically conductive substrate wherein at least a portion of said electrically conductive substrate has an inorganic and chromate free surface wherein said surface comprises a first film comprising at least one silicate and a second film upon the first film comprising silica, and at least one coating composition adhered to said second film.
A substrate having a surface that reduces molten metal adhesion to the surface relative to an untreated surface wherein the surface is formed upon the substrate by a method comprising:
contacting at least a portion of the surface with a medium comprising at least one silicate and having a basic pH and wherein said medium is substantially free of chromates,
introducing a current to said medium wherein said surface is employed as a cathode,
forming a first layer upon the surface comprising at least one silicate and a second layer upon the first layer comprising silica;
and
recovering the substrate.
2 more elements
A zinc plated article having a surface coating comprising at least one silicate, a silica containing layer upon the surface coating and an organic coating upon the silica containing layer.
09/814,641Filed 22 Mar 2001 · continuation in part
Priority
31 Jan 1997
Published
US 2002/0012804 A19 May 2002
Granted
29 Jul 2003
Term ended
21 Apr 2018Estimated · howhide20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment, including 81 days of adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.
Applying non-metallic protective coatings: for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Life of this patent
Term ended 21 Apr 2018 (estimated)
Priority31 Jan 1997
Filed22 Mar 2001
Published9 May 2002
Granted29 Jul 2003
Term ended21 Apr 2018
Priority31 Jan 1997
Granted29 Jul 2003
Term ended21 Apr 2018
Priority claimedParent application 60/036,024
Application filedUS 09/814,641
Assigned to Elisha Technologies Co LLCassignment of assignor's interest
PublishedUS 2002/0012804 A1
Assigned to Elisha Holding LLCassignment of assignor's interest
GrantedUS 6,599,643 B2
Assigned to Accuride Corporationassignment of assignor's interest
Assigned to Wells Fargo Bank, National Associationsecurity interest
Assigned to Accuride Corporation, Accuride Emi, LLC, Gunite Corporationrelease of security interest
Assigned to Royal Bank of Canadaabl credit agreement
Assigned to Royal Bank of Canadasecurity interest
Term endedEstimated, includes 81 days of adjustment
Assigned to Bank of America, N.A., AS Successor Agentpatent security interest assignment agreement
Assigned to Alter Domus (US) LLC, AS Successor Collateral Agentassignment to security interest in patents at reel 040680/frame 0557 to successor collateral agent by resigning collateral agent
Assigned to Accuride Corporation, Kic LLC, Gunite Corporation, Accuride Emi, LLCrelease of u.s. security interest in patents
Assigned to Accuride Corporation, Gunite Corporation, Kic LLCrelease of security interest
Description23,191 words
Summary1,010 words
#The instant invention relates to process for forming a deposit on the surface of metallic or conductive surfaces. The process employs an electrolytic process to deposit, for example, a mineral containing coating or film upon a metallic, metal containing or an electrically conductive surface.
#Silicates have been used in electrocleaning operations to clean steel, tin, among other surfaces. Electrocleaning is typically employed as a cleaning step prior to an electroplating operation. Using “Silicates As Cleaners In The Production of Tinplate” is described by L. J. Brown in February 1966 edition of Plating; hereby incorporated by reference.
#Processes for electrolytically forming a protective layer or film by using an anodic method are disclosed by U.S. Pat. No. 3,658,662 (Casson, Jr. et al.), and United Kingdom Patent No. 498,485; both of which are hereby incorporated by reference.
Brief description of the drawings2 figures
#FIG. 1 is a schematic drawing of the circuit and apparatus which can be employed for practicing an aspect of the invention.
#FIG. 2 is a schematic drawing of one process that employs the inventive electrolytic method.
Detailed description22,144 words
#The instant invention relates to a process for depositing or forming a beneficial surface (e.g., a mineral containing coating or film) upon a metallic or an electrically conductive surface. The process employs a silicate medium, e.g., containing soluble mineral components or precursors thereof, and utilizes an electrically enhanced method to treat an electrically conductive surface (e.g., to obtain a mineral coating or film upon a metallic or conductive surface). By “mineral containing coating”, “mineralized film” or “mineral” it is meant to refer to a relatively thin coating or film which is formed upon a metal or conductive surface wherein at least a portion of the coating or film comprises at least one metal containing mineral, e.g., an amorphous phase or matrix surrounding or incorporating crystals comprising a zinc disilicate. Mineral and Mineral Containing are defined in the previously identified Copending and Commonly Assigned Patents and Patent Applications; incorporated by reference. By “electrolytic” or “electrodeposition” or “electrically enhanced”, it is meant to refer to an environment created by introducing or passing an electrical current through a silicate containing medium while in contact with an electrically conductive substrate (or having an electrically conductive surface) and wherein the substrate functions as the cathode. By “metal containing”, “metal”, or “metallic”, it is meant to refer to sheets, shaped articles, fibers, rods, particles, continuous lengths such as coil and wire, metallized surfaces, among other configurations that are based upon at least one metal and alloys including a metal having a naturally occurring, or chemically, mechanically or thermally modified surface. Typically a naturally occurring surface upon a metal will comprise a thin film or layer comprising at least one oxide, hydroxides, carbonates, sulfates, chlorides, among others. The naturally occurring surface can be removed or modified by using the inventive process.
#The electrolytic environment can be established in any suitable manner including immersing the substrate, applying a silicate containing coating upon the substrate and thereafter applying an electrical current, among others. The preferred method for establishing the environment will be determined by the size of the substrate, electrodeposition time, applied voltage, among other parameters known in the electrodeposition art. The effectiveness of the electrolytic environment can be enhanced by supplying energy in the form of ultrasonic, laser, ultraviolet light, RF, IR, among others. The inventive process can be operated on a batch or continuous basis.
#The silicate containing medium can be a fluid bath, gel, spray, among other methods for contacting the substrate with the silicate medium. Examples of the silicate medium comprise a bath containing at least one silicate, a gel comprising at least one silicate and a thickener, among others. The medium can comprise a bath comprising at least one of potassium silicate, calcium silicate, lithium silicate, sodium silicate, compounds releasing silicate moieties or species, among other silicates. The bath can comprise any suitable polar carrier such as water, alcohol, ethers, among others. Normally, the bath comprises sodium silicate and de-ionized water and optionally at least one dopant. Typically, the at least one dopant is water soluble or dispersible within an aqueous medium.