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US 6,599,623 B2Granted
Nanoparticles formed with rigid connector compounds
AssigneeInternational Business Machines Corporation
InventorsStephen McConnell Gates, Christopher Bruce Murray
Life of this patent
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Abstract
The present invention relates to a novel organosilicon particle having the formula SiaObCcHd. The particle may be coated with an organic film, preferably a rigid connector compound. The present invention also provides a method of using the organosilicon particle and/or rigid connector compound in the formation of a low-k dielectric film.
Claims13
A nanoparticle comprising a core material particle, and attached thereto, a rigid connector compound;
- wherein said rigid connector compound has at least two binding sites that are prevented from attaching to the same core material particle by the rigidity of said rigid connector compound.
Dependencies are inferred from the claim text.