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US 6,599,617 B2Granted
Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof
AssigneeSony Corporation
InventorYoshinari Matsuda
Life of this patent
Estimating the term…
Abstract
Copper foil lands provided with a through-hole filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands normally occurs to obtain a copper-plated through-hole in both sides of a printed wiring board using a paper-phenol substrate, wherein adhesion strength between the copper foil lands and the copper paste is enhanced.
Claims2
A printed wiring board formed by a laminate comprising a paper-phenol substrate clad on two surfaces with a metallic foil, wherein
- a pair of metallic foil lands are located on opposite sides of said two surfaces of said paper-phenol substrate and are each provided around a through-hole filled with a conductive paste, each said land having a metallic-foil-removed portion having a rough surface and in the form of one of a ring in contact with and completely surrounding said through-hole and a plurality of slits radiating from and in contact with said through-hole, whereby said metallic-foil-removed portion enhances an adhesion strength between said pair of metallic foil lands and said conductive paste.
Dependencies are inferred from the claim text.