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US 6,599,583 B1Granted
Method for making segemented through holes in printed circuit boards
OwnerN. Edward Berginventor
Life of this patent
Estimating the term…
Abstract
A method for forming segmented through holes in a printed circuit board. The segmented through holes comprise a plurality of electrically conductive pathways disposed on the walls of a single through hole. The segmented through hole can be disposed in a two sided circuit board assembly or in a composite, multi layer circuit board assembly.
Claims10
A method for making a segmented through hole in a printed circuit board, comprising the steps of:
- applying a mixture comprising an ink containing magnetic particles to the walls of a through hole disposed in a circuit board;
- subjecting said circuit board to an energy field to form the mixture into a segmented pattern on said walls.
Dependencies are inferred from the claim text.