Rigid-printed wiring board and production method of the rigid-printed wiring board
AssigneesSony Corporation, Shirato Printed Circuit Board Co. Ltd.
InventorsYoshinari Matsuda, Tomohide Koguchi
Life of this patent
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Abstract
The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.
Claims2
A production method of a rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein
- a degassing through hole is provided in the vicinity of a via hole for filling a copper paste, and
- the copper paste is filled in the via hole, dried, and thermally cured.
A production method of a rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein
- a copper foil land for a via hole for filling a copper paste and a copper foil part in the periphery thereof are formed separately such that the copper foil land for the via hole and the copper foil part in the periphery thereof are connected electrically so as for a copper foil non-formation part to be provided between the copper foil land for the via hole and the copper foil part in the periphery thereof,
- comprising the steps of filling the copper paste in the via hole, and drying as well as thermally curing it.
Dependencies are inferred from the claim text.