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US 6,599,435 B2Granted
Method for controlling flatness of wafer and manufacturing method of thin-film magnetic head
AssigneeTDK Corporation
InventorsToshio Kubota, Fujimi Kimura
Life of this patent
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Abstract
A gas at an extremely low temperature is jet-sprayed onto a warped concave surface of a wafer to correct this warped concave surface flat.
Claims10
A method for controlling a flatness of a wafer with a warped concave surface, comprising the steps of:
- disposing said wafer on a table;
- and
- jet-spraying a gas at an extremely low temperature onto said surface of said wafer on the table to correct the warped concave surface flat.
A manufacturing method of a thin-film magnetic head comprising the steps of:
- forming on a surface of a wafer a plurality of thin-film magnetic transducer elements;
- when one surface of said wafer warps as a warped concave surface, jet-spraying a gas at an extremely low temperature onto said warped concave surface of said wafer to correct the warped concave surface flat;
- and
- separating said wafer into individual thin-film magnetic heads.
1 more element
Dependencies are inferred from the claim text.