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US 6,599,372 B2Granted
Soldering flux
AssigneeFry's Metals, Inc.
InventorsSanyogita Arora, Alvin F. Schneider, Karen A. Tellefsen
Life of this patent
Estimating the term…
Abstract
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.
Claims29
A soldering flux comprising:
- water;
- a non-acidic, water-insoluble resin dispersed in the water;
- and
- an activating agent in the water.
1 more element
A soldering flux comprising:
- water;
- a pentaerythritol ester of hydrogenated rosin in the water;
- and
- an activating agent in the water.
1 more element
A method for treating a printed circuit board comprising the steps of:
- providing a printed circuit board;
- and
- applying an aqueous flux including a non-acidic resin onto a surface of the printed circuit board to form a flux coating on the surface.
A printed circuit board comprising:
- a printed circuit substrate;
- and
- a flux including a non-acidic resin on the substrate.
A soldering flux comprising:
- water;
- a resin emulsified in the water;
- and
- an activating agent in the water.
1 more element
A method for treating a printed circuit board comprising the steps of:
- providing a printed circuit board;
- and
- applying an aqueous flux onto a surface of the printed circuit board to form a flux coating on the surface, the aqueous flux comprising water and a resin emulsified in the water.
Dependencies are inferred from the claim text.