Stabilized alkaline compositions for cleaning microelectronic substrates

A composition for stripping or cleaning integrated circuit substrates, comprising:

• (a) one or more metal ion-free bases present in the composition in an amount sufficient to produce a pH of the composition of from about 11 to 13;
• (b) from about 0.1 to about 50% by weight of the composition of at least one bath stabilizing agent comprising at least one compound with at least one pKa in the range of 10 to 13;
• and
• (c) water;
• (d) with the proviso that when the semiconductor wafer substrate has aluminum or aluminum alloy present the composition also contains from about 0.01% to about 5% by weight of the composition of a water-soluble metal ion-free silicate.

A method for cleaning semiconductor wafer substrates having copper, aluminum or alloys thereof, comprising:

• contacting a semiconductor wafer substrate having a substrate surface for a time and at a temperature sufficient to clean unwanted contaminants and residues from said substrate surface with a composition comprising:
• (a) one or more metal ion-free bases in an amount sufficient to produce a pH of the composition of about 11 or greater;
• (b) a bath stabilizing effective amount of at least one bath stabilizing agent comprising at least one compound with at least one pKa in the range of 10 to 13;
• (c) water;
• and
• (d) from about 0.01% to about 5% by weight of the composition of a water-soluble metal ion-free silicate.

A method for cleaning semiconductor wafer substrates, comprising:

• contacting a semiconductor wafer substrate having a substrate surface for a time and at a temperature sufficient to clean unwanted contaminants and residues from said substrate surface with a composition comprising:
• (a) one or more metal ion-free bases present in the composition in an amount to provide a pH of the composition of from about 11 to 13;
• (b) at least one bath stabilizing agent comprising at least one compound with at least one pKa in the range of 10 to 13, with the one or more bath stabilizing agent present in the composition in an amount of from about 0.1 to about 50% by weight of the composition;
• and
• (c) water.

A method of extending bath-life of an aqueous alkaline composition for stripping or cleaning integrated circuit substrates wherein said composition comprises:

• (a) one or more metal ion-free bases in an amount sufficient to produce a pH of the composition of about 11 or greater;
• (b) water;
• and
• (c) from about 0.01% to about 5% by weight of the composition of a water-soluble metal ion-free silicate;
• said method comprising adding to said composition a bath stabilizing effective amount of at least one bath stabilizing agent comprising at least one compound having at least one pKa in the range of 10 to 13.