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US 6,599,178 B1Granted
Diamond cutting tool
AssigneeGFD Gesellschaft fur Diamantprodukte mbH
InventorsPeter Gluche, Andre Flöter
Life of this patent
Estimating the term…
Abstract
A cutting tool with a synthetic diamond layer 2 having a cutting edge 5 is described, wherein the cutting edge 5 has a profile structured by etching of decreasing layer thickness. Furthermore, a process is described for producing such a cutting tool.
Claims9
Cutting tool with a synthetic diamond layer having a cutting edge on the synthetic diamond layer, said synthetic diamond layer having a thickness of 1 to 500 μm, wherein the cutting edge has a profile of decreasing layer thickness, wherein the synthetic diamond layer is arranged directly onto a surface of a depositing substrate material.
Dependencies are inferred from the claim text.