Apparatus for distributing a fluid through a polishing pad

A fluid delivery system for delivering a fluid to a top surface of a polishing pad comprising:

• a) a polishing pad having a plurality of apertures;
• b) a plurality of stacked layers supporting the polishing pad, wherein each stacked layer has a groove in fluid communication with the apertures in the polishing pad;
• c) a platen supporting the plurality of stacked layers, wherein the platen has an aperture in fluid communication with the grooves in the plurality of stacked layers, wherein the distance a fluid must travel from the platen aperture to any of the apertures in the polishing pad is substantially the same;
• and
• d) a motion generator for causing relative motion between a wafer and a top surface of the polishing pad.

A fluid delivery system for delivering a fluid to a top surface of a polishing pad comprising:

• a) a polishing pad having a plurality of apertures;
• b) a plurality of stacked layers supporting the polishing pad, wherein each stacked payer has a groove in fluid communication with the apertures in the polishing pad;
• c) a platen supporting the plurality of stacked layers, wherein the platen has an aperture in fluid communication with the grooves in the plurality of stacked layers, wherein the distance of fluid must travel from the platen aperture to any of the apertures in the polishing pad is substantially the same;
• d) a motion generator for causing a relative motion between a wafer and a top surface of the polishing pad;
• e) a carousel apparatus for transporting the wafer above the polishing pad;
• and
• f) a carrier mounted to the carousel for holding the wafer.