High frequency board-to-board connector
AssigneeInstitute of Microelectronics
InventorsYong Kee Yeo, Mahadevan K Iyer, Edwin Lim, Ke Hor Seah, Weng Chiok Thong
Life of this patent
Estimating the term…
Loading patent…
AssigneeInstitute of Microelectronics
InventorsYong Kee Yeo, Mahadevan K Iyer, Edwin Lim, Ke Hor Seah, Weng Chiok Thong
Estimating the term…
The invention relates to a high frequency board-to-board connector for interconnecting electronic sub-assemblies. The high frequency board-to-board connector includes a row of conductive pins received in an insulative housing for connecting with receptacles of a design. Two discrete electronic sub-assemblies, for example PCBs, can be mechanically and electrically connected without the need for a gender male connector on one PCB and a corresponding gender female connector on the other PCB. A plurality of follower arms spaced apart along the grounding plate facilitates contact with a ground plane in the design to form a ground path. The ground path reduces electromagnetic coupling between any pair of conductive pins and consequentially lowering cross-talk noise. Furthermore, inductive parasitics of the conductive pins is reduced, further facilitating high frequency operations.
A high frequency board-to-board connector for connecting with a design comprising:
A high frequency board-to-board connector for connecting with a design comprising:
A high frequency board-to-board connector for interconnecting a pair of designs comprising:
Dependencies are inferred from the claim text.