Socket apparatus for a plug-in module
AssigneeHewlett-Packard Development Company, L.P.
InventorsSteven D. Sheldon, David R. Cowles, Melissa S. Gedraitas
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorsSteven D. Sheldon, David R. Cowles, Melissa S. Gedraitas
Estimating the term…
A socket apparatus for receiving and supporting a plug-in module in a host device such as a peripheral device. The socket apparatus is mounted and fully supported by a printed circuit board and requires no additional support from the host device chassis or by a cosmetic case or housing. The apparatus is elevated relative to the printed circuit board so that valuable real estate on the board is not appreciably diminished by the apparatus. The apparatus provides an effective low impedance REI ground path, provides support to the host electrical connector and minimizes a number of parts and tolerance stack-up.
Apparatus for receiving a plug-in electronic module in a host device having at least one printed circuit board and a multi-conductor first connector operably connected to the printed circuit board, the module having a second connector for coupling said module with said first connector, said apparatus having a connector end portion and a receiving end portion opposite said connector end portion, said apparatus comprising:
A socket apparatus for receiving a plug-in electronic module in a host device having at least one printed circuit board and a multi-conductor first connector operably connected to the printed circuit board, the module having a second connector for electrically and mechanically interconnecting said module with said first connector, said socket apparatus comprising:
A method of providing support for a cartridge on a host device, the host device having at least one printed circuit board and a multi-conductor first connector operably connected to the printed circuit board, the cartridge having a second connector for electrically and mechanically interconnecting said cartridge with said first connector, comprising:
Apparatus for receiving a plug-in electronic module in a host device having at least one printed circuit board and a multi-conductor first connector operably connected to the printed circuit board, the module having a second connector for coupling said module with said first connector, said apparatus having a connector end portion and a receiving end portion opposite said connector end portion, said apparatus comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Coupling devices mounted on the edge of the printed circuits: coupling devices presenting arrays of contacts
Electrically-conductive connections
Term ended 16 Jan 2021 (estimated)
The present invention relates to apparatus for supporting modular electronic subsystems on electrical and electronic devices, and more particularly to a socket apparatus for receiving and supporting modular devices that are inserted into a host device, such as a printer or other peripheral device.
It has been a common practice in the manufacture of electronic components to provide additional functional capability in the form of modular electronic subsystems that can be easily coupled to larger electronic devices. One common example involved the use of font cartridges on laser and other printers in home and office environments. Such font cartridges were merely plugged into the printer and provided additional fonts for the user. Other examples included transceiver slots on network switches and in internal print servers and modules for multi-function peripheral devices, which could scan, fax, print and copy. The use of modular subsystems or components to vary the functionality of such peripheral devices was a convenient, flexible and inexpensive alternative to the replacement of such devices or the need to manufacture many different models of such devices to satisfy differing functional needs.
The disadvantages of such previous solutions included the necessity of using additional parts to provide mechanical support and retention of the auxiliary module. They also required the maintenance of tight tolerances between the host electrical connection and the module support. Some of the solutions also lacked a low impedance ground path, which can be important for reliability of operation. Moreover, some solutions utilized plastic resin which affected the amount of space required to provide sufficient mechanical strength.
FIG. 1 is an isometric view of the rear of the socket apparatus of the present invention with portions removed, but shown mounted to a printed circuit board together with a right angle multi-pin connector and also illustrating a module adapted for insertion into the socket apparatus.
FIG. 2 is a isometric view of a front portion of the socket apparatus shown in FIG. 1 mounted to the printed circuit board and also illustrating the insertable module.
FIG. 3 is an isometric view of the front and left side of socket apparatus embodying the present invention.
Broadly stated, the present invention is directed to a socket apparatus that is adapted to receive an electronic module with the socket apparatus being installed in a host device, such as a peripheral electronic device. The socket apparatus embodying the present invention is preferably mounted to a printed circuit board having a plurality of components mounted thereon, including a connector which is adapted to receive a mating connector in the module that is to be inserted into the socket apparatus. In addition to providing support for the module and facilitating the coupling of the connectors, the socket apparatus is designed to provide a low impedance radio frequency ground path to minimize electrical interference that may detrimentally affect the operation of the host device and/or module combination. It is therefore preferable that the socket apparatus be made of conductive metal which may be relatively thin but strong and provide adequate physical support for the plug-in module.
The socket structure is designed to be mounted to the printed circuit board and provide a low impedance ground path from the structure to the printed circuit board. The unique design provides support and protection for the host electrical connector and promotes design efficiency and maximizes use of the real estate of a printed circuit board. This is because the bulk of the socket apparatus is elevated above the printed circuit board so that circuit components can be mounted in the space between the socket apparatus and the surface of the printed circuit board. The mounting of the socket apparatus to the printed circuit board enables the designer to easily design the opening in the housing or case of the host peripheral so that the module can be easily plugged in by a user. Because the socket apparatus guides the module into position so that the connectors are aligned for coupling, the tolerances of the position of the socket apparatus relative to the peripheral chassis and the outer case of the host peripheral need not be particularly tight.
Turning now to the drawings and particularly FIGS. 1 and 2, the socket apparatus embodying the present invention is indicated generally at 10 and is shown mounted to a printed circuit board 12 that is not in and of itself a part of the present invention. The printed circuit board also has a multi-pin connector 14 attached thereto, and it is a right angle connector which is accessible from the interior of the socket apparatus 10. A module 16 is shown and it has a connector 18 that is adapted to mate with the connector 14 when the module 16 is inserted into the socket apparatus 10.