Optical/electrical interconnects and package for high speed signaling

An opto-electrical printed circuit board (PCB) comprising:

• a base material;
• at least one optical fiber on the surface of the base material;
• and
• at least two transparent substrates imbedded in the base material,
• wherein the at least one optical fiber provides a high speed interconnect between at least two electronic devices attached to the PCB, the at least two electronic devices interfacing to the at least one optical fiber through the at least two transparent substrates.

An opto-electrical package comprising:

• a base material, the base material having a top side and a bottom side, the top side having connection points for attaching an electronic component;
• at least one optical receiver attached to the bottom side of the base material;
• at least one optical transmitter attached to the bottom side of the base material;
• an encapsulating polymer, the encapsulating polymer embedded in the base material facing the bottom side and covering the at least one optical receiver and the at least one optical transmitter;
• at least one power connection point attached to the bottom side of the base material;
• and
• at least one ground connection point attached to the bottom side of the base material.